Copper Powder (fine), PurReagent >99.7%
PurReagent
Properties
| Vapour pressure | 0Pa at 20 |
| Water Solubility | Insoluble |
| Assay Purity | >99.7% |
| B pt. | 2567 °C |
| M pt. | 1083.4 °C |
| Density | 8.94 g/mL |
| Form | Solid |
Safety Information
| Hazard Statement(s) | H251,H410 |
| Precautionary Statement | P235 - P273 - P280 - P391 - P403 + P235 - P407 |
| GHS Pictogram |
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| Signal word | Danger |
| HS Code | 74061000 |
| Flash point | -23 °C |
| Storage Temp. | Room Temperature |
| Storage Class | 4.2 - Pyrophoric and self-heating hazardous materials |
| UN Number | 3089 |
Description
Application
It serves in electronics for conductive inks metallurgy for sintering and 3D printing for parts fabrication.
Purpose
Its fundamental purpose is to efficiently transfer electricity and heat across global power grids electronics and heating systems serving as a foundational building block for modern infrastructure.
General Description
Copper powder (Cu CAS 7440-50-8) forms a fine ductile reddish metallic solid with density 8.94 gcm and melting point 1083C.
Documents
| SDS | |
| COA | |
| Specification | |
| Bulk quote order form | |
| Sample COA |
